Three-dimensional flexible interposer

ABSTRACT

A generally planar interposer having a plurality of interposer contact pads to contact a plurality of first contacts of a first electronic device on one side of the interposer, and a plurality of electrical connections between the interposer contact pads and a plurality of pressure contacts on the other side of the interposer. Each of the pressure contacts having a directionally deformable contact surface to removably contact a plurality of second contacts of a second electronic device on the other side of the interposer. Also methods of forming the interposer.

FIELD

Electronic device connectors and attachments, and the manufacturethereof.

BACKGROUND

Electronic devices having a field or array of contacts are typicallyconnected to other similar devices using molded socket devices, springclip devices, or other mechanical packaging devices that cause the fieldor array of contacts of one device to individually contact or registerwith the field or array of contacts of the other device. Moreover, it isoften necessary to permanently connect the contacts of such devicestogether for proper use. For example, a relatively expensive, separate,molded socket device, or device having “spring clips” is typically usedto connect a land grid array (LGA) of a microprocessor, digitalprocessor, or other integrated circuit device to a printed circuit board(PCB). In addition, such current designs may register or attach contactsindividually, may not allow the LGA to be removed, may require selectivegold plating on the PCB contacts, may not be permanently attached to thePCB, may not directly attach the LGA to the PCB, and/or may causeattachment of the LGA to the PCB to be difficult.

BRIEF DESCRIPTION OF THE DRAWINGS

Embodiments are illustrated by way of example and not by way oflimitation in the figures of the accompanying drawings in which likereferences indicate similar elements. It should be noted that referencesto “an” embodiment in this disclosure are not necessarily to the sameembodiment, and they mean at least one.

FIG. 1 is a schematic cross section view of an interposer for connectinga first electronic device to a second electronic device.

FIG. 2 is a schematic cross section view of a structure including a domeshaped pressure contact for connecting a contact of a first electronicdevice to a contact of a second electronic device.

FIG. 3 is a schematic cross section view of a structure including a domeshaped pressure contact complying under a contact pressure applied bythe contact of an electronic device.

FIG. 4 is a schematic cross section view of an interposer removablyconnecting or attaching contacts of a LGA to contacts of a PCB.

FIG. 5 is a schematic top view of an electrically conductive pad to beformed into a pressure contact.

FIG. 6 is a schematic cross section view of an interposer having anelectrically conductive pad formed on one side; a trace pad, trace, andinterposer contact pad formed on another sides; and an electricalconnection between the electrically conductive pad and the trace pad,prior to forming a pressure contact.

FIG. 7 is a top section view of a trace pad, trace, and interposercontact pad prior to forming a pressure contact.

FIG. 8 is a bottom section view of a first surface of an interposer forconnecting to a field or array of contacts of a first electronic device.

FIG. 9 is a top section view of a second surface of an interposer forconnecting to a field or array of connectors of a second electronicdevice.

FIG. 10 is a three-dimensional top perspective view of FIG. 2.

DETAILED DESCRIPTION

FIG. 1 is a schematic cross section view of an interposer for connectinga first electronic device to a second electronic device. FIG. 1 showsapparatus 100, which may generally be referred to as an interposer orflexible three dimensional two sided circuit component forelectronically connecting a first electronic device to a secondelectronic device for a variety of styles and applications. Apparatus100 has interposer contact pads 112, 113, 114, 115 and 116 on first side118 of generally planar interposer 110 and pressure contacts 122, 123,124, 125, and 126 formed on and including interposer 110 and havingcontact surfaces 142, 143, 144, 145, and 146 on second side 148 ofinterposer 110. In accordance with embodiments, interposer contact pads112 through 116 may contact first contacts 132, 133, 134, 135, and 136of first electronic device 130, such as by forming permanent orremovable electrical connections or attachments. Likewise, pressurecontacts 122 through 126 and contact surfaces 142, 143, 144, 145, and146 may form removable or permanent electrical connections orattachments to contacts of another electronic device, such as byremovably contacting second contacts 162, 163, 164, 165, and 166 ofsecond electronic device 160. FIG. 1 also shows electrical connections172, 173, 174, 175, and 176 between interposer contact pads 112 through116 and pressure contacts 122 through 126.

For example, pressure contacts 122 through 126 and contact surfaces 142through 146 may be directionally deformable in direction D to and fromsecond side 148 or contact surface 142 towards and away from first side118 or first contact 132. Moreover, electrical connections 172 through176 may also be directionally deformable in direction D as describedabove. Thus, apparatus 100 may be configured (e.g., such as by selectingthe proper materials and geographic layout for interposer 110, pressurecontacts 122 through 126, electrical connections 172 through 176, andinterposer contact pads 112 through 116) to simultaneously physicallyalign (e.g., such as alignment with respect to direction D) andsimultaneously electronically connect first contacts 132 through 136with second contacts 162 through 166 (e.g., such as by allowingapparatus 100 to be placed or disposed with respect to first device 130and second device 160 to allow first contacts 132 through 136 and secondcontacts 162 through 166 to be registered via physical attachment andelectrical connection through apparatus 100).

For example, according to embodiments, apparatus 100 may be used toremovably contact contacts or contact pads of second electronic device160, such as a land grid array (LGA), a main grid array, an integratedcircuit, a semiconductor device, a digital processor, and/or a memorymodule or chip. Similarly, apparatus 100 may be used to removably orpermanently contact or be electronically attached to contacts or contactpads of first device 130, such as a PCB, an electronic board havingconductive traces, a computer electronic board, a “mother board”, and/ora memory module or chip board. Thus, apparatus 100 may be disposedbetween a first and second electronic device having a land pattern,grid, array, or other suitable geographic layout of electronic contactsor contact pads.

In order to provide a more detailed view of pressure contact 122, FIG. 2is a schematic cross section view of a structure including a dome shapedpressure contact for connecting a contact of a first electronic deviceto a contact of a second electronic device. FIG. 2 shows structure 200including pressure contact 122 and three dimensional dome 221 with domeheight DH and dome diameter DD formed in generally planar interposer 110under pressure contact 122. For example, dome height DH may be a heightof between four mils and 250 mils in distance from a top surface ofcontact surface 142 to a bottom surface of interposer 110, and domediameter DD may be a diameter of between five mils and 50 mils indiameter, as shown in FIG. 2.

Also, FIG. 2 shows electrical connection 172 having conductiveconnection 282 disposed in hole 292 extending from first side 118 tosecond side 148 of interposer 110. Generally planar interposer 110 hasfirst thickness T1. Thus, electrical connection 172 and conductiveconnection 282 may be sufficient to provide electrical conductivitybetween contact surface 142 and interposer contact pad 112 forelectronic functionality of first and second electronic device 130 and160 such as by allowing sufficient Watts in power to be transferred fromfirst contact pad 132 to second contact pad 162 through apparatus 100for proper operation of second electronic device 160, as describedabove.

According to embodiments, dome 221 and/or pressure contact 122 maydefine shapes other than a dome, such as by defining a cone, a bubble, adimple, a depression, an indentation, a hemispherical shape, or variousother appropriate shapes having a height above a hollow or vacant regionand providing an elasticity as described herein. Specifically, forexample, pressure contact 122 may be a pressure contact similar to thatused in an electronic device remote control (e.g., such as a televisionor video cassette recorder remote control) or a telephone keypad. Thus,pressure contact 122 may have a first height H1 of between four mils and250 mils in distance from a top surface of contact surface 142 and abottom surface of interposer 110 as shown in FIG. 2. Note that firstheight H1 as described above and shown in FIG. 2 is a representativeheight.

FIG. 2 also shows electrical connection 172 including trace 272electronically connecting interposer contact pad 112 to trace pad 271 onfirst side 118. Trace pad 271 is in turn electronically connected topressure contact 122 via electronically conductive connection 282disposed through hole 292. For example, conductive connection 282 may bea plated through hole or a conductive filler disposed in hole 292.Furthermore, according to embodiments, electrical connection 172, tracepad 271, trace 272, and conductive connection 282 may be selected toinclude materials and to have a geographic layout sufficient to form anappropriate electronically conductive path between interposer contactpad 112 and contact surface 142 of pressure contact 122 as describedherein. For example, trace 272, trace pad 271, conductive connection282, and pressure contact 122 may be formed of a conductive material(e.g., such as copper, gold, silver, aluminum, titanium, alloy, and/or ametal) having a sufficient electronically conductive path, location,thickness, elasticity, and durability selected to survive flexing orbeing directionally deformed in direction D in response to pressure P asdescribed herein. Thus, such selections may be made to minimize tracestress caused by forming pressure contact 122, such as during formationof dome 221, and during pressure P applied to pressure contact 122 atcontact surface 142, as described below.

Specifically, dome diameter DD, dome height DH, interposer material(e.g., such as a plastic material used to form interposer 110, having aselected elasticity), and first thickness T1 may be selected to havesufficient characteristics to allow dome 221 and pressure contact 122 toflex, such as in direction D, in response to a pressure P having amaximum of, for example, between 0.1 Newton and 1.0 Newton (e.g., suchas a pressure of 0.4 Newton) in pressure applied to pressure contact 122without permanently deforming or damaging dome 221 and/or pressurecontact 122.

Thus, structure 200 shown in FIG. 2 (e.g., and similar structures ofapparatus 100), or a structure other than a dome (e.g., such asalternate structures described above for pressure contact 122 and dome221), but having sufficient materials and structure may be selected towithstand a maximum selected value of pressure P, as described above,such as by having a modulus of elasticity greater than the maximumpressure, force, or strain expected at contact surface 142.

For example, FIG. 3 is a schematic cross section view of a structureincluding a dome shaped pressure contact complying under a contactpressure applied by the contact of an electronic device. FIG. 3 showsstructure 400 having pressure contact 122, complying or flexing undercontact pressure P applied to contact surface 142 as described above,without permanently deforming or damaging pressure contact 122 and/orwithout permanently deforming or damaging trace 272, trace pad 271,conductive connection 282, interposer 110, or contact surface 142.

For instance, structure 400 may represent structure 200, as shown inFIG. 2, after pressure P is applied to contact surface 142 (e.g., suchas one of multiple structure of apparatus 100). Thus, structure 200 andpressure contact 122 may have a property such that when pressure P isapplied to a top surface of pressure contact 122, such as contactsurface 142, pressure contact 122 flexes to second height H2 (e.g., adistance in height from the top surface of contact surface 142 to abottom surface on first side 118 of interposer 110) while pressure P isapplied, wherein second height H2 is less than first height H1 by aheight difference HD between 0 mils and 10 mils in distance. It iscontemplated that height difference HD may be a distance between 1 milsand 10 mils, such as a distance between two mils and five mils, inheight. Note that second height H2 and height difference HD as describedabove and shown in FIG. 3 are representative heights.

Consequently, according to embodiments, structure 200 and/or structure400 (e.g., such as a structure having pressure contact 122, trace 272,trace pad 271, conductive connection 282, contact surface 142, andinterposer 110 forming dome 221 or 421) may have a modulus of elasticitygreater than pressure P such that structure 200 and/or structure 400(e.g., including pressure contact 122) can flex, comply, or bedirectionally deformable to and from first height H1 and second heightH2 (e.g., between the shape of dome 221 and dome 421) without causingpermanent deformation or damage to structure 200 and/or structure 400and the components thereof. In other words, the shape of pressurecontact 122, as described above, may transition in geometric shapebetween the shapes of structure 200 and structure 400 shown in FIGS. 2and 3, such as by being temporarily modified in shape to the shape shownin FIG. 3 while pressure P is applied to contact surface 142 andreturning to the shape shown in FIG. 2 when pressure P is removed fromcontact surface 142.

In order to provide such flexibility and elasticity, generally planarinterposer 110 may include a layer or film having first thickness T1 ofa material such as a polyamide, a polyester, a polycarbonate, a Mylar®,a polyvinyl chloride (PVC), a cellulose acetate, or a plastic materialsufficient so that pressure contact 122 survives pressure P as describedabove. Moreover, it is contemplated that interposer 110 include anelastic material or a self-expanding material, such as a material havinga shape memory where the memorized shape is the expanded shape, suchthat removing pressure P applied to contact surface 142 allows dome 421to automatically expand to its approximate original shape of dome 221prior to application of pressure P (e.g., the shape shown in structure200).

According to embodiments, contact surface 142 may include conductormaterial 444, such as copper, gold, silver, or a conductor as describedabove with respect to trace 272, having attachment surfaces 445 and 446plated or coated with a metal, such as plated with gold or silver.Similarly, interposer contact pad 112 may be an electrically conductivematerial 414 (e.g., similar to conductor material 444 described above)having attachment surface 416 with or without a metal coating orplating, such as with or without a plating of gold or silver. Likewise,first contact 132 may include conductive material 434 (such as describedabove with respect to conductive material 444) having attachment surface436 with or without a metal coating or plating, such as with or withouta plating of silver or gold. Thus, for example, if interposer contactpad 112 is removably attached to first contact 132, such as by pressurecontact without solder, attachment surface 416 and/or attachment surface436 may include a plating or coating as described above. Alternatively,if interposer contact pad 112 is permanently attached to first contact132, such as by solder 404, attachment surface 416 and/or attachmentsurface 436 may be without or exclude a metal plating or coating, suchas to form a sufficient solder connection between them without metalplating. More particularly, solder 404 may be a solder, conductivepaste, and/or a conductive adhesive used during an assembly process ofelectronic devices, including processes using a solder mask, a solderbump, a conductive paste, a conductive adhesive, a solder paste, and/ora reflow electronic conductive technology technique.

According to embodiments, it is also contemplated that attachmentsurfaces 445/446 and attachment surface 466 may be conductive materialswith or without electrically conductive coating as described above withrespect to surfaces 416 and 436, such as to form a permanent orremovable attachment between contact surface 142 and second contact 162.Hence, contacts on one side of apparatus 100 may be permanently attachedto first electronic device 130, such as a PBA, during assembly processesof electronic devices. Furthermore, contacts on the other side ofapparatus 100 may be configured such that apparatus 100 is or allows forremovable direct attachment of an LGA (e.g., a second electronic device160) to a PCB (e.g., a first electronic device 130) so that multipleLGAs may be switched onto and off of the PCB using apparatus 100.

It can be appreciated that for apparatus 100 as shown in FIG. 1, apressure total that is the sum of pressure P applied to each contactsurface 142 (e.g., of structure 200) can be calculated. Such a totalpressure may represent the pressure incident upon contact surfaces 142through 146 from a LGA that apparatus 100 is connecting to a PCB. Forexample, FIG. 4 is a schematic cross section view of an interposerremovably connecting or attaching contacts of a LGA to contacts of aPCB. For instance, PCB 330 has first contact pads 332, 333, 334, 335,and 336 (e.g., which may have a geographic pattern of, or be part of agrid or array of contacts) and LGA 360 has second contact pads 362, 363,364, 365, and 366 (e.g., which may have a geographic pattern of, or bepart of a grid or array of contacts). FIG. 4 shows LGA 360 connected toPCB 330 via apparatus 100, where pressure total PT is visited upon LGA360 by backing plate 306 and mechanical pressure fasteners 302 and 304clamping backing plate 306 and LGA 360 to pressure total PT, such as amaximum compressive force associated with or selected by stand-offheight H4 of stand-offs 308 and 309. It is also contemplated thatstructure 300 may include array registration pins and/or stand-off pinsto define pressure total PT.

According to embodiments, apparatus 100 may be configured tosimultaneously physically align and simultaneously electronicallyconnect first contact pads 332, 333, 334, 335, and 336 of PCB 330 withsecond contact pads 362, 363, 364, 365, and 366 of LGA 360. Forinstance, pressure contacts 122–126 may have a pattern corresponding toa pattern of second contact pads 362–366 and interposer contact pads112–116 may have a pattern corresponding to a pattern of first contactpads 332–336. Therefore, apparatus 100 can physically align contact padsof LGA 360 with those of PCB 330, such as by a visual alignment, anoptical alignment, and/or a mechanical alignment. An example of amechanical alignment may be where backing plate 306 and/or a backboardcoupled to LGA 360 includes pins or other mechanical alignment featuresfor engaging apparatus 100, mechanical pressure fasteners 302 and 304,stand-offs 308 and 309, and/or PCB 330 to align second contact pads362–366, pressure contacts 122–126, interposer contact pads 112–116,and/or first contact pads 332–336.

Furthermore, in accordance with embodiments, apparatus 100 may beconfigured so that pressure contacts 122 through 126 removablyelectronically connect second contacts 362 through 366 via a removableor permanent connection between interposer contact pads 112 through 116and first contacts 332 through 336, without connection sockets, pins,spring loaded connections, spring loaded connectors, leads, ballconnections, solder balls, spring clips, and/or other packagingsolutions. Furthermore, apparatus 100 may be configured as describedherein so that height difference HD (e.g., of structure 200 and/or 400)is sufficient to eliminate or reduce any co-planarity issues between LGA360 and PCB 330, such as those related to second contacts 362 through366 and first contacts 332 through 336 not being in exact flat planealignment with respect to each other.

Next, FIG. 5, FIG. 6, and FIG. 7 are used to illustrate structures 200and/or 400 prior to forming first height H1 (e.g., of apparatus 100,such as those related to pressure contact 122). FIG. 5 is a schematictop view of an electrically conductive pad to be formed into a pressurecontact. FIG. 5 shows electrically conductive pad 522 having RAD 1, suchas an electrically conductive pad to be formed into pressure contact 122having contact surface 142 (see FIG. 2). FIG. 5 also shows conductiveconnection 582, such as for providing electrical conduction betweenelectrically conductive pad 522 and another electrically conductivestructure.

Related to FIG. 5, FIG. 6 is a schematic cross section view of aninterposer having an electrically conductive pad formed on one side; atrace pad, trace, and interposer contact pad formed on another sides;and an electrical connection between the electrically conductive pad andthe trace pad, prior to forming a pressure contact. Also related to FIG.5, FIG. 7 is a top section view of a trace pad, trace, and interposercontact pad prior to forming a pressure contact. FIG. 7 shows structure700 having interposer contact pad trace 512, trace length 572, and flattrace pad 571. FIG. 7 also shows conductive connection 582 forelectronically connecting structure 700 (e.g., such as flat trace pad571 of structure 700) to electrically conductive pad 522, such as viahole 592 having RAD 2, as shown in FIG. 6.

According to embodiments the following measurements as identified inFIGS. 5–7 may be representative of the physical dimensions as identifiedin FIGS. 5–7 or may be representative of the corresponding features instructures 200 as shown in FIG. 2 after formation of dome 221. Thus,electrically conductive pad 522 may have RAD 1 between 2.5 mils and 25mils, and flat trace pad 571 may have radius RAD 3, and interposercontact pad trace 512 may have radius RAD 4 similar to RAD 1. Thus,width W1 may be a width of between five mils and 50 mils in width, andlength L1 may be a length of between 10 mils and 350 mils in length. Inaddition, trace length 572 may have width W2 of between two mils and 150mils in width, and hole 592 may have radius RAD 2 of between one mil and5 mils. Although FIG. 7 shows width W2 less than width W1, in accordancewith embodiments, width W2 may be greater than width W1, such as bybeing greater than width W1 so that structure 700 forms a “football”shape that is thickest in the middle (e.g., at width W2) and narrows atthe ends (e.g., at the radii of flat trace pad 571 and contact pad trace512, distal from width W2). Note that measurements provided above forradii RAD 1, RAD 2, RAD 3, and RAD 4; widths W1 and W2; and length L1are representative.

FIG. 6 also shows interposer 510 having first thickness T1 which may bea thickness of between one mil and 20 mils (e.g., such as a thickness of20 mils), electrically conductive pad 522 having second thickness T2between 0.5 mils and 5 mils (e.g., such as a thickness of 2 mils), andinterposer contact pad trace 512 having third thickness T3 between 0.5mils and 5 mils (e.g., such as a thickness of 2 mils). According toembodiments flat trace pad 571 may have fourth thickness T4 similar tothird thickness T3, and trace length 572 may have fifth thickness T5 ofbetween 0.25 mils and five mils (e.g., such as a thickness of 2 mils).Note that thicknesses T1 through T5 are representative thicknesses.

Accordingly, structures 200 and/or 400 (e.g., of apparatus 100 (seeFIGS. 2 and 3)) may be formed by forming structures 700 aligned on afirst side of interposer 510, forming electrically conductive pads 522on a second side of interposer 510, and forming electrical connectionssuch as conductive connections 582 between the electrically conductivepads and the flat trace pads, such as to form structure 600 shown inFIG. 6. It can be appreciated that structures 700 and electricallyconductive pads 522 may be formed by PCB fabrication techniques forproducing two-sided flexible circuitry, including print and etchtechnology, pattern and etch technology, screen printed conductortechnology, and/or a combination thereof. Next, structure 600 can beformed into a three dimensional pressure contacts at electricallyconductive pad 522, such as to form pressure contact 122 as shown instructures 200 and/or 400 (see FIGS. 2 and 3). For example, structure600 may be formed into structure 200, such as by using a pressurefixture, a pressure platen, a temperature fixture, a temperature platen,and/or by techniques to form structure 200 with pressure contacts 221having a shape and functional characteristics as described herein.

Consequently, upon forming three dimensional pressure contacts, such asstructure 200, it is to be appreciated that interposer 510 may betransformed into interposer 110, flat trace pad 571 may be transformedinto trace pad 271, trace length 572 may be transformed into trace 272,interposer contact pad trace 512 may be transformed into interposercontact pad 112, conductive connection 582 may be transformed intoconnection 282, hole 592 may be transformed into hole 292, andelectrically conductive pad 522 may be transformed into pressure contact122 having contact surface 142.

FIG. 8 is a bottom section view of a first surface of an interposer forconnecting to a field or array of contacts of a first electronic device(e.g., first electronic device 130 shown in FIG. 1). FIG. 8 shows firstside 118 of interposer 110 having a 5×11 array or geographic pattern oftrace pad 271, trace 272, and interposer contact pad 112 combinations,wherein each combination defines a “dog-bone” or dumbbell shape. FIG. 8also shows a spacing L2 of between 20 mils and 80 mils (e.g., such asthe spacing between contact pads or pins of a device described above forfirst device 130 or second device 160) between a first interposercontact pad 816 (e.g., such as a pad sufficient to conduct electricityto and from a first contact of an electronic device) and a secondadjacent interposer contact pad 817 (e.g., such as a pad sufficient toconduct electricity to and from a second contact of the same electronicdevice). It can be appreciated that interposer contact pads 816 and 817may be similar to interposer contact pad 112 as described above, such asby including attachment surfaces that may be permanently attached tocontact surfaces of a PBA by solder or conductive paste. In addition,although FIG. 8 shows a 5×11 array, it is contemplated that apparatus100 may be formed with first side 118 having a larger or smaller sizeand/or population of interposer contact pad for contacting orelectronically interfacing with electronic devices having variouslysized and populated arrays of contacts. For example, apparatus 100 mayinclude interposer contact pads 112 for contacting pressure contacts orpermanent contacts of a 25×25 array or grid of an electronic device,such as a PBA.

FIG. 9 is a top section view of a second surface of an interposer forconnecting to a field or array of contacts of a second electronic device(e.g., second electronic device 160 illustrated in FIG. 1). FIG. 9 showssecond 148 of interposer 110 having a 5×11 array or geographic patternof pressure contacts 122. FIG. 9 also shows a spacing L3 of between 20mils and 80 mils (e.g., such as the spacing between contact pads or pinsof a device described above for first device 130 or second device 160)between a first pressure contact 945 (e.g., such as a pad sufficient toconduct electricity to and from a first contact of an electronic device)and a second adjacent pressure contact 946 (e.g., such as a padsufficient to conduct electricity to and from a second contact of thesame electronic device). It can be appreciated that pressure contacts945 and 946 may be similar to pressure contact 122 as described above,such as by including attachment surfaces that may be removably attachedto contact surfaces of a PBA by solder or conductive paste. In addition,although FIG. 9 shows a 5×11 array, it is contemplated that apparatus100 may be formed with second side 148 having a larger or smaller sizeand/or population of pressure contacts for contacting or electronicallyinterfacing with electronic devices having variously sized and populatedarrays of contacts. For example, apparatus 100 may include pressurecontacts 122 for contacting pressure contacts or permanent contacts of a25×25 array or grid of an electronic device, such as a LGA. Hence,according to embodiments, apparatus 100 may be configured so thatinterposer contact pads 112, as shown in FIG. 8 and pressure contacts122, as shown in FIG. 9 simultaneously physically align andelectronically connect a corresponding pattern of contacts of a firstelectronic device on one side of apparatus 100 to those of a secondelectronic device on the other side of apparatus 100.

Hence, apparatus 100 may include pressure contacts 122 on one side ofthe apparatus having an axis or center separated a distance of between2.5 mils and 75 mils in distance from an axis or center interposercontact pads 112 on the other side of the apparatus (e.g., such as forpressure contacts 122 and interposer contact pads 112, as shown in FIGS.1, 4, 8, and 9). Similarly, it is contemplated that a center of radiusRAD1 may be a distance of 5, 10, 15, 25, 30, 40, 50, 60, or 70 mils fromthe center of radius RAD4, as shown in FIGS. 5–7.

According to embodiments, various adaptations and alterations of thestructures shown in FIGS. 1–9 are contemplated. For example, thosefamiliar with the industry or field of the art will recognize that, withrespect to FIG. 2, trace pad 271, trace 272, and interposer contact pad112 combinations, may be formed on both, first side 118 and second side148 of interposer 110. Thus, conductive connection 282 may be disposedthrough a hole extending from first side 118 to second side 148 ofinterposer 110 at interposer contact pad 112, as well as/or instead ofwhere shown in FIG. 2. Also, it is contemplated that dome 221 could beformed in a downward manner at interposer contact side 112 instead ofwhere it is shown formed in FIG. 2. In addition, the structure shown inFIG. 2 or the structure described above with dome 221 formed atinterposer contact pad 112 may be inverted so that second side 118 isabove second side 148, such as an orientation opposite that shown inFIG. 2. Finally, trace pad 271 and trace 272 may be formed on secondside 148 of interposer 110 and attach to pressure contact 122. Thus,trace pad 271 may be attached to contact pad 112 via a conductiveconnection 282 disposed through a hole extending from first side 118 tosecond side 148 of interposer 110 at interposer contact pad 112.Moreover, combinations of the adaptations and alterations describedabove may be formed.

In the foregoing specification, specific embodiments are described.However, various modifications and changes may be made thereto withoutdeparting from the broader spirit and scope of embodiments as set forthin the claims. The specification and drawings are, accordingly, to beregarded in an illustrative rather than a restrictive sense.

1. An apparatus comprising: a plurality of interposer contact pads on afirst side of a generally planar interposer, the interposer contact padsaligned on the first side to contact a plurality of first contacts of afirst electronic device; a plurality of pressure contacts formed in theinterposer, the pressure contacts having a contact surface on a secondside of the interposer to removably contact a plurality of secondcontacts of a second electronic device; a plurality of electricalconnections between the interposer contact pads and the pressurecontacts; wherein the pressure contacts and the contact surface aredirectionally deformable in a direction from the second side of thegenerally planar interposer towards the first side.
 2. The apparatus ofclaim 1, wherein the interposer has a spacing of the pressure contactsrelative to the interposer contact pads to simultaneously physicallyalign and simultaneously electronically connect the first contacts withthe second contacts.
 3. The apparatus of claim 2, wherein the spacing isbetween 15 mils and 50 mils in distance between a center of theinterposer contact pads and a center of the pressure contacts tosimultaneously electronically connect a plurality of contact pads of aland grid array (LGA) and a plurality of contact pads of a printedcircuit board (PCB).
 4. The apparatus of claim 1, wherein the pressurecontacts comply under a contact pressure applied to the contact surfaceof between 0.2 Newton and 0.6 Newton in pressure applied to the pressurecontacts without permanently deforming or damaging the pressurecontacts.
 5. The apparatus of claim 1, wherein the pressure contactsinclude a plurality of flexible three-dimensional domes formed in thegenerally planar interposer under the pressure contacts.
 6. Theapparatus of claim 1, wherein the pressure contacts have a first heightof between 4 mils and 20 mils in distance from a top surface of thecontact surface to the first side of a generally planar interposer. 7.The apparatus of claim 6, wherein the pressure contacts have a propertysuch that while a pressure is applied to the top surface, the pressurecontact flexes to a second height in distance from a top surface of thecontact surface to the first side of the interposer, and wherein thesecond height is less than the first height by a height difference ofbetween 2 mils and 10 mils in distance.
 8. The apparatus of claim 7,wherein the pressure contacts have a modulus of elasticity greater thanthe pressure applied.
 9. The apparatus of claim 1, wherein the generallyplanar interposer has a thickness of between 1 mil and 20 mils, thecontact surface has a thickness of between 0.5 mils and 5 mils, and theinterposer contact pads have a thickness of between 0.5 mils and 5 mils.10. The apparatus of claim 1, wherein the generally planar interposerincludes a layer of one of a polyimide, a polyester, a polycarbonate, aMylar®, a polyvinyl chloride (PVC), a cellulose acetate, and a plasticmaterial.
 11. The apparatus of claim 1, wherein the contact surfaceincludes a conductor material having a surface plated or coated with ametal.
 12. The apparatus of claim 1, wherein the interposer contact padsare conductive material without a metal coating or plating and areconfigured to be permanently attached to the first contacts by one ofsolder, conductive paste, and conductive adhesive.
 13. An apparatuscomprising: a generally planar shaped base having a first side, a secondside, and a plurality of holes extending through the base from the firstside to the second side; a plurality of interposer contact pads alignedon the first side of the planar shaped base to electronically connect toa plurality of first contact pads of a first electronic device; aplurality of pressure contacts, each having a directionally deformablecontact surface on the second side of the planar shaped base to formremovable electrical pressure connections to a plurality of secondcontact pads of a second electronic device; a plurality of traces on thefirst side electronically connecting the interposer contact pads to aplurality of trace pads of electrically conductive material; whereinrespective ones of the plurality of trace pads include an electricalconnection disposed through one of the plurality of holes to respectiveones of the plurality of pressure contacts.
 14. The apparatus of claim13, wherein the trace pad, trace, and interposer contact pad define adog-bone or dumbbell shape.
 15. The apparatus of claim 13, wherein theelectrical connection includes one of a plated through hole and aconductive filler in a hole.
 16. The apparatus of claim 13, wherein thepressure contacts include a plurality of domes having a dome diameterand a dome height, each dome comprising a plastic material having anelasticity and a thickness sufficient to flex in response to a maximumpressure of between 0.4 Newton and 1.4 Newton in pressure applied to thepressure contacts without permanently deforming or damaging the pressurecontacts.
 17. The apparatus of claim 16, wherein the pressure contactshave a modulus of elasticity greater than the pressure applied.
 18. Theapparatus of claim 13, wherein the pressure contacts have a radius ofbetween 2.5 mils and 25 mils in distance; the trace pad, trace, andinterposer contact pad define a length of between 10 mils and 350 milsin distance; and the trace has a width of between 2 mils and 150 mils indistance.
 19. The apparatus of claim 13, wherein each pressure contacthas a pressure attachment surface to removably attach to a secondcontact, and there is a spacing of between 20 mils and 80 mils indistance between adjacent pressure attachment surfaces.